Striving for Perfection - MEMS Sensors Based on Wafer Chip Fabrication Process Technology

Xiaohan Yin; Kang Shuai; Chunxiu Su

doi:10.54691/7yd8n579

Authors

Xiaohan Yin
Kang Shuai
Chunxiu Su

DOI:

https://doi.org/10.54691/7yd8n579

Keywords:

Mechanical engineering; MEMS; Micro-Electro-Mechanical Systems; Etching Process.

Abstract

To promote independent technological advancement in chips and break through the technical blockade faced by China's sensor industry, this work has developed a novel process. This process utilizes the solid porous 3D microstructure of Broussonetia papyrifera to achieve microscale thermal isolation, while proposing the use of thin-film layered structures of Broussonetia papyrifera to optimize and improve existing thermal MEMS devices. Breakthroughs in process preparation technology enable the production of precision MEMS sensors. Currently, this product achieves a micron-level process grade and supports wafer fabrication in both 8-inch and 10-inch sizes. Under the same 10-inch standard scale, the unit batch yield reaches 98.76%, with up to 576 sensor chips per single wafer, representing industry-leading performance. Due to these characteristics, the product has been widely applied in smart vehicles, intelligent healthcare, electronic resonance sensors, and other fields.

Downloads

Download data is not yet available.

References

[1] Liu Y ,Zhang Y ,Zhang Y , et al.Three‐dimensional Quantitative Evaluation of Interfacial Mass Transfer for Performance Enhanced and Durable Large‐scale Reversible Protonic Ceramic Cells (Small 31/2025)[J].Small,2025,21(31):2570239-2570239.

[2] Xu Z ,Sun J ,Dake M J , et al.Grain boundary properties and microstructure evolution in an Al-Cu alloy[J].Acta Materialia,2025,292121041-121041.

[3] D’hers S ,Siegel L E ,Ismirlian D , et al.A wearable wireless controlled-release device as the next-generation personal protection against vector-borne diseases[J].Cell Reports Physical Science, 2025, 6(7): 102693-102693.

[4] Zhichao Y , Qianyun L , Hexiang G , et al. Integrated solar-powered MEMS-based photoelectrochemical immunoassay for point-of-care testing of cTnI protein.[J]. Biosensors & bioelectronics, 2022, 223115028-115028.

[5] Sakamoto H ,Hatsuda R ,Miyamura K , et al.Capillary phenomenon-based pump-less biochip for uric acid determination[J].Micro & Nano Letters,2013,8(6):274-276.

[6] Huang C ,Li L ,Li Q .Synergistic Optimization of High-Temperature Mechanical Properties and Thermal Conductivity in B4C/Al Composites Through Nano-Al2O3 Phase Transformation and Process Engineering[J].Metals,2025,15(8):874-874.V

[7] García M I G ,Khandelwal V ,Lu Y , et al.Inductively Coupled Plasma Reactive Ion Etching of (−201) β‐Ga2O3 Nano‐Fins[J].physica status solidi (b),2024,262(8):2400290-2400290.

[8] Chang B ,Anand A G ,Liu X , et al.Field enhancement effect in reactive ion etching – a novel mechanism for plasma processing and plasma diagnostics[J].Materials & Design,2025,254114144-114144.

[9] Behrmann O ,Kyoushi N ,Bodduluri T M , et al.Wafer-level chip-scale packaging of MEMS environmental sensors by functionalized porous PowderMEMS® micro-filters [J]. Journal of Micromechanics and Microengineering,2025,35(2):025005-025005.

[10] Thomas L ,Ole B ,Björn G .PowderMEMS—A Generic Microfabrication Technology for Integrated Three-Dimensional Functional Microstructures[J].Micromachines,2022,13(3):398-398.

[11] Huang C ,Cui L ,Wei G , et al.Effect of porous structural characteristics on the thermal conductivity of mesoporous silica by combined molecular dynamics and lattice dynamics methods[J].Journal of Non-Crystalline Solids,2025,657123495-123495.

[12] Dong N ,Hongtao G .Thermal Conductivity of Ordered Porous Structures Coupling Gas and Solid Phases: A Molecular Dynamics Study[J].Materials,2021,14(9):2221-2221.

[13] Bi J ,Liang Y ,Bai Y , et al.Simultaneous realization of high power factor and low thermal conductivity in medium-entropy La-doped (Sr1/3Ba1/3Ca1/3)1-xLaxTiO3 oxides with porous structure [J]. Chemical Engineering Journal,2024,491151895-.

[14] Lei Yuzhang. Simulation of Morphological Effects in Advanced Plasma Dry Etching Processes phoxinus phoxinus subsp. phoxinus and Validation Study [D]. North China University of Technology,2025.DOI:10.26926/d.cnki.gbfgu.2025.000226.

[15] Wang Jing. Design of Plasma Etching Machine Control System [D]. Dalian Polytechnic University.,2023.DOI:10.26992/d.cnki.gdlqc.2023.000450.

[16] Du Wentao, Zeng Zhigang, Hu Zhiyu. Research on RIE Etching Process of Silicon Oxide[J]. Semiconductor Optoelectronics,2014,35(01):57-60.DOI:10.16818/j.issn1001-5868.2014.01.015.

[17] Wu Yuxuan, Wang Haijun, Qiao Jialong, et al. Preliminary Thermodynamic Calculation on the Influence of Si, Al, and Mn Elements on the Fundamental Physical Properties of Non-oriented Silicon Steel[J]. Electrical Steel,2025,7(04):25-31.

[18] Cui Zhaoxuan, Lin Xin, Geng Zhenxin, et al. Calculation of Physical Property Parameters for Arc Plasma in Novel Environmentally Friendly CF3OCF=CF2/CO2 Gas Mixture [J/OL]. High Voltage Engineering.,1-9[2025-09-09].https://doi.org/10.13336/j.1003-6520.hve.20250434.

[19] Bi Cheng, Tang Guihua, Fu Bo. Numerical Study on Phonon Thermal Conductivity of Nanoporous Junction Broussonetia Papyrifera Single-Crystal Silicon Thermoelectric Thin Films[J]. Journal of Xi'an Jiaotong University.,2017,51(05):23-30.

[20] Xu Lujia, Hu Ming, Yang Haibo, et al. Study on the thermal conductivity of porous silicon insulation layers based on microstructural parameter modeling of Broussonetia papyrifera [J]. Acta Physica Sinica,2010,59(12):8794-8800.

[21] Han Ke, Liu Xuefei, Prunus salicina Yilong, et al. Research on the Application of Micro-Mechanical Switch Sensors in Integrated Circuits[J]. Marine Electric Technology., 2025, 45(01): 29-34.DOI:10.13632/j.meee.2025.01.015.

[22] Yu Zhoushun. Silicon-Based Micromachining Technology[J]. Electronics World, 2016, (23): 161.DOI:10.19353/j.cnki.dzsj.2016.23.123.

[23] Tian Yuhao, Guo Jinghui, Lin Guiping. Flow and Transport Characteristics Inside Porous Microstructures of Thermal Protection Materials in High-Temperature Environments broussonetia papyrifera [C]//Fluid Mechanics Committee, Chinese Society of Theoretical and Applied Mechanics. Abstracts of the 13th National Conference on Fluid Mechanics (Volume I). Department of Aircraft and Environmental Engineering, School of Aeronautical Science and Engineering, Beijing University of Aeronautics and Astronautics utetheisa kong; International Innovation College, Beijing University of Aeronautics and Astronautics utetheisa kong homo sapiens, 2024:316.DOI:10.26914/c.cnkihy.2024.054496.